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20/4/2012 6 single chip assemblies have been made with die from wafer V6ABC1H and sensors from Pixel II 2873_18 ([[sensors]]). Sensor - Die attachment details: 2873-18: SE3 - V6ABC1H Die 8 2873-18: SC3 - V6ABC1H Die 10 2873-18: SC4 - V6ABC1H Die 11 2873-18: SE4 - V6ABC1H Die 15 2873-18: SC5 - V6ABC1H Die 16 2873-18: SC6 - V6ABC1H Die 17 -- Main.RichardBates - 2012-04-20
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Topic revision: r1 - 2012-04-20
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RichardBates
ATLAS/PUUKA
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