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Thin film hybrid in MCM D technology Processing on blank silicon wafers to determine the feasibility of building a fully functional circuit in this technology. The...
Estimates of the total capacitive load The capacitive load on the front end is expected to change due to the presence of a ground plane close to the strips. The capacitance...
FredDoherty 2012 06 29 Wire Bonding Trials To achieve correct measurements as above (assuming samples are exactly the size designed) Silicon (with DC) and 200um long...
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