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25/07/2012 The Quad assemblies 2 and 3 are made with full thickness ROIC as there is a worry about wafer bow and unbonded edge pixels. Stock Location StatusOfAssemblies...
Module Assembly Details of module assembly are given here Single chip card Assembly Details SCCvFEI4B Some notes on assembly, including wirebond program, are...
Characterisation of Single Devices in Glasgow University and the UK Assembly Details SCCvFEI4B Some notes on assembly, including wirebond program, are given here...
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