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IndiumModules
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---+ Indium Bumped Modules This page will serve as a database for characterisation of Indium Bumped Modules developed at RAL. Indium bumps require pressure only to make connections so no high temperatures are required to melt alloy, which reduces bowing effects. ---++++ Modules under test: | *ID* | *bond force* | *comment* | | 14-07-24-S2 | 20kg | | | 14-07-25-S2 | 10kg | | | 14-07-25-S4 | 5kg | | ---++ IV Scans ---++ Tuning ---+++ USBPix ---+++ RCE System ---++ Bump yield results -- %USERSIG{KateDoonan - 2014-08-28}% ---++ Comments <br />%COMMENT%
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Topic revision: r2 - 2014-09-24
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KennyWraight
ATLAS/PUUKA
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