Indium Bumped Modules

This page will serve as a database for characterisation of Indium Bumped Modules developed at RAL. Indium bumps require pressure only to make connections so no high temperatures are required to melt alloy, which reduces bowing effects.

Modules under test:

ID bond force commentSorted ascending
14-07-24-S2 20kg  
14-07-25-S2 10kg  
14-07-25-S4 5kg  

IV Scans



RCE System

Bump yield results

-- Kate Doonan - 2014-08-28


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Topic revision: r2 - 2014-09-24 - KennyWraight
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