25/07/2012 The Quad assemblies 2 and 3 are made with full thickness ROIC as there is a worry about wafer bow and unbonded edge pixels. Stock Location StatusOfAssemblies...
Unfortunately this assembly was broken due to an accident with the probe station. The detector of the assembly was being IVed on arrival in Glasgow, before wirebonding...
Assembly 5 Device IV after flip chip and mouting on the SCC. Assembly5 02082012.pptx: Presentation of scans performed on Assembly 5 VTT Assembly5 3200e 100V...
The single chip card usually has a cut out below the FE I4A chip to facilitate Sr 90 source tests. The FE I4A is mounted on a 0.5mm Al plate that is glued to the SSC...