Difference: MCMD (28 vs. 29)
Revision 292010-06-18 - LarsEklund
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| < < | Wafer and sensor numbering scheme | |||||||
| > > | Thin film hybrid in MCM-D technologyPhotos at reception of first thin film hybrid batch
Wafer and sensor numbering scheme Run 1 | |||||||
| The wafers are marked with sensor number at the wafer edge close to the larger straight section of the border. The individual sensors are labelled by their X and Y positions on the wafer. The classification of the wafers and the definition of the wafer number can be found in SensorNumbering.pdf. | ||||||||
View topic | History: r33 < r32 < r31 < r30 | More topic actions...
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