Difference: MCMD (16 vs. 17)

Revision 172008-12-16 - LarsEklund

Line: 1 to 1

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Wafer and sensor numbering scheme

The wafers are marked with sensor number at the wafer edge close to the larger straight section of the border. The individual sensors are labelled by their X and Y positions on the wafer. The classification of the wafers and the definition of the wafer number can be found in SensorNumbering.pdf.

Sensor number scheme

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Photos at reception of Run 1 wafers

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Electrical measurements of Run 1

I/V and C/V measurements of all sensors before dicing

Inter-strip capacitance measurements of all sensors before dicing

Documentation and photos

Photos at reception of the wafers

Bias bonds on measured wafers

Yield measurements

Mechanical measurements

Sensor flatness

Photos at reception of Run 1 wafers

The photos were taken at reception of the wafers, but after wafers w09 and w14 had some of their ground planes bonded to the bias rails. Bond tests and tuning were done on the large metallised area at the bottom of w09. The bonds are visible in the photos. The bias bond locations are described in BiasBonds.pdf.

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