These pages contain details of the characterization of single devices in the UK.
They include 3D and planar devices.
First off is some details on device characterization.
Device characterzation notes
- Kate's notes from 2011
- Additional notes
- Prim list
Some notes on assembly, including wirebond program and design of Al plate, are given here for the single chip card
AssemblyDetails
3D
GE_FBK4_3D_07
Planar
MPI - ??
Micron - ??
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RichardBates - 2012-02-22