These pages contain details of the characterization of single devices in the UK.

They include 3D and planar devices.

First off is some details on device characterization.

Device characterzation notes

  • Kate's notes from 2011
  • Additional notes
  • Prim list

Some notes on assembly, including wirebond program and design of Al plate, are given here for the single chip card

AssemblyDetails

3D

GE_FBK4_3D_07

Planar

MPI - ??

Micron - ??

-- RichardBates - 2012-02-22

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Topic revision: r1 - 2012-02-22 - RichardBates
 
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