-- FredDoherty - 2012-06-29

Hybrid Bonding Diagrams

https://twiki.cern.ch/twiki/pub/Atlas/ModuleAssembling4ATLASSCTUpgrade/Stave_Hybrid_WireBonding.pdf

Shunts

The current drawn by the readout ASICs depends on their operational mode. The constant current
supply is set to the maximum expected hybrid current and shunt regulation is used to keep the
voltage across the hybrid constant. The latest generation of prototype readout ASIC is made in the
IBM 250nm process and termed ABCN-25 Already, this ASIC contains custom circuitry for
the implementation of shunt regulation.

There are two shunt regulation options within the ABCN-25, termed M-shunt and W-shunt.

The M-shunt option uses two shunt transistors in each ASIC, controlled by a voltage from an
external circuit.

The W-shunt option uses both shunt and control circuitry within the ASIC itself.

Shunt regulation may also be implemented outside the readout ASIC, using discrete compo-
nents or an additional ASIC.

Addressing of ASICS and Hybirds

On each hybrid panel each ASIC can be addressed by a combination of wire bonds to the PCB., It's different for each asic on the hybrid, but this system does not change from hybrid to hybrid

This allows one row of asics to be numbered 32-41 and the other 64-73

When the module is being wire bonded, each hybrid panel is wire bonded to another mounted pcb on the module (the BCC)

The left one (if the LVDS lines are at the bottom) is wire bonded to label it BCC=62, and the right BCC=61

This systems stays the same for every module we wire bond.
.

At the system tests point I address each Hybrid by it's BCC number, and it has it's own associated data file

If i name 4 hybrid files differently, you can then test 4 hybrids (2 modules) even if there are 2 panels with a BCC of 61, and 2 with a BCC of 62

BCC information

Pinout

# Name I/O Description
1 DATA0_M In Data input from ABCN (Column 0, Bottom)
2 DATA0_P In
3 ABCN_RESETB_M Out RESETBsignal to ABCNs
4 ABCN_RESETB_P Out
5 ABCN_L1_M Out L1 signal to ABCNs
6 ABCN_L1_P Out
7 VDD

8 GND

9 ABCN_COM_M Out COM signal to ABCNs
10 ABCN_COM_P Out
11 ABCN_DCLK_M Out ABCN Data Clock
12 ABCN_DCLK_P Out
13 ABCN_BCO_M Out ABCN Bunch Clock
14 ABCN_BCO_P Out
15 ABCN_MODE80 Out ABCN MODE80
16 DATA2_M In Data input from ABCN (Column 1, Bottom)
17 DATA2_P In
18 DATA3_M In Data input from ABCN (Column 1, Top)
19 DATA3_P In
20 DATAOUT_M Out Multiplexed data sent to DAQ
21 DATAOUT_P Out
22 ID0 In BCC ID bit 0 set (internally pulled-up)
23 ID1 In BCC ID bit 1 set (internally pulled-up)
24 ID2 In BCC ID bit 2 set (internally pulled-up)
25 ID3 In BCC ID bit 3 set (internally pulled-up)
26 ID4 In BCC ID bit 4 set (internally pulled-up)
27 ID5 In BCC ID bit 5 set (internally pulled-up)
28 VDD

29 GND

30 CM_TP Out Clock Multiplier Test Point
31 COM_FB_M In COM Feedback
32 COM_FB_P In
33 COM_M In DAQ Command line
34 COM_P In
35 L1R_FB_M In L1R feedback
36 L1R_FB_P In
37 L1R_M In DAQ Combined Level-1/Reset signalling
38 L1R_P In
39 BCO_M In Bunch Clock
40 BCO_P In
41 DATA1_M In Data input from ABCN (Column 0, Top)
Topic attachments
I Attachment History Action Size Date Who CommentSorted ascending
PowerPointppt Bonding_Hybrid_glasgow_29feb.ppt r1 manage 8827.5 K 2012-07-02 - 11:01 FredDoherty First attempt at ATLAS Hybrid Bonding on BJ820 at Glasgow
PowerPointppt Bonding_module_glasgow_29feb.ppt r1 manage 8827.5 K 2012-07-02 - 11:01 FredDoherty First attempt at ATLAS Hybrid Bonding on BJ820 at Glasgow
Topic revision: r4 - 2012-08-20 - AndrewBlue
 
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