Searched: ^T
Results from ATLAS/PUUKA web retrieved at 10:46 (GMT)
Results from ATLAS/PUUKA web retrieved at 10:46 (GMT)
ThomasMcMullen 2012 07 13
RichardBates 2011 04 16
RichardBates 2010 12 16 Sensors Connectivity Modules Connectivity
Thermal FEA Heat load from RD53A chip For the cooling capacity calculations and the FEA simulations the heat load of the RD53A chip is required. Power from the RD53A...
Thin chip assemblies To be able to flip chip very thin ROICs addtional work is required to prevent the ROIC from bowing duringthe solder re flow process. At present...
Number of topics: 5
Topic revision: r32 - 2017-09-22 - RichardBates
ATLAS/PUUKA Web
Create New Topic
Index
Search
Changes
Notifications
RSS Feed
Statistics
Preferences
ATLAS |
|
Copyright © 2008-2024 by the contributing authors. All material on this collaboration platform is the property of the contributing authors. Ideas, requests, problems regarding TWiki? Send feedback