IV Characteristics of the FBK 7 assembly: IV Curve FBK 200212.xlsx Details of noise characterisation of the FBK 7 assembly: FBK Noise.pptx Further information on FBK...
FEI 4 Documentation Documentation for FEI can be found at https://espace.cern.ch/atlas pixel upgrade elec/Final%20Design/Reference/ (NB: Requires cern id and...
24th 25th June 2015 Manchester INDICO: https://indico.cern.ch/event/402689/ 10 11th December 2013 Manchester INDICO agenda, slides etc : https://indico.cern.ch/event...
Flip chip bump deposition at CEA Leti and Flip chip at Advacam The first phase of the development with CEA Leti was the deposition of copper pillars with SAC solder...