Difference: MCMD (29 vs. 30)
Revision 302010-06-28 - LarsEklund
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| < < | Thin film hybrid in MCM-D technology | |||||||
| > > | Thin film hybrid in MCM-D technologyProcessing on blank silicon wafers to determine the feasibility of building a fully functional circuit in this technology. The cricuit has five metal layers and hosts 20 front-end ASICS. Electrically it is an exact copy of the silicon tracker upgrade hybrid designed in Liverpool. Specification of first version | |||||||
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Photos at reception of first thin film hybrid batch | ||||||||
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| > > | Post processing of sensor wafer: Run 1Processing on electrical and mechanical grade sensor wafers to investigate the influence on the sensor performance. The processing involved a single metal layer, with the cross-section shown in the figure below. | |||||||
Wafer and sensor numbering scheme Run 1The wafers are marked with sensor number at the wafer edge close to the larger straight section of the border. The individual sensors are labelled by their X and Y positions on the wafer. The classification of the wafers and the definition of the wafer number can be found in SensorNumbering.pdf. | ||||||||
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| < < | Thin film hybridSpecification of first version | |||||||
| -- LarsEklund - 21 Nov 2008 | ||||||||
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