Difference: MCMD (25 vs. 26)
Revision 262009-04-06 - LarsEklund
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Wafer and sensor numbering scheme | ||||||||
| Line: 9 to 9 | ||||||||
I/V and C/V measurements of all sensors before dicing | ||||||||
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| > > | I/V measurements of all sensors after dicing | |||||||
| Inter-strip capacitance measurements of all sensors before dicing | ||||||||
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| > > |
Capacitance between strip and GND plane
Summary of capacitive load measurements
Inter-strip resistiance
Punch-through measurement | |||||||
Documentation and photosPhotos at reception of the wafers | ||||||||
View topic | History: r33 < r32 < r31 < r30 | More topic actions...
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