Difference: MCMD (1 vs. 2)

Revision 22008-11-21 - LarsEklund

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META TOPICPARENT	name="WebHome"

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Wafer and sensor numbering scheme

The wafers are marked with sensor number at the wafer edge close to the larger straight section of the border. The individual sensors are labelled by their X and Y positions on the wafer. The classification of the wafers and the definition of the wafer number can be found in SensorNumbering.pdf.

Sensor number scheme

Photos at reception of Run 1 wafers

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Full wafer views:

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The photos were taken at reception of the wafers, but after wafers w09 and w14 had some of their ground planes bonded to the bias rails. Bond tests and tuning were done on the large metallised area at the bottom of w09. The bonds are visible in the photos. The bias bond locations are described in BiasBonds.pdf.

Full wafer views

	6 μm BCB	12 μm BCB
Electrical	w14, w15	w08, w09
Mechanical	w17, w18, w19	w04, w05, w16

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Delivery report from Acreo

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Close-up views on a few sensors

Meshed GND plane, full view

Bias bond, close-up

Meshed GND plane, top half

Meshed GND plane, full view

Solid GND plane, top half

Triangular GND plane, full view

-- LarsEklund - 21 Nov 2008

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Revision 12008-11-21 - LarsEklund

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META TOPICPARENT	name="WebHome"

Photos at reception of Run 1 wafers

Full wafer views:

	6 μm BCB	12 μm BCB
Electrical	w14, w15	w08, w09
Mechanical	w17, w18, w19	w04, w05, w16

Delivery report from Acreo

-- LarsEklund - 21 Nov 2008

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