Difference: SingleDeviceCharacterization (1 vs. 2)

Revision 22012-08-02 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
These pages contain details of the characterization of single devices in the UK.
Deleted:
<
<		They include 3D and planar devices.
 First off is some details on device characterization.

Device characterzation notes

Line: 15 to 13
  AssemblyDetails
Changed:
<
<

3D

>
>

Planar from VTT

 
Changed:
<
<		GE_FBK4_3D_07

Planar

>
>		15 single assemblies have been produced at VTT. These area detailed at Assemblies.

Summaries and root data files for the assemblies tested are given under the assembly heading.

 
Changed:
<
<		MPI - ??
>
>		Assembly test data
 
Changed:
<
<		Micron - ??
>
>		Assembly5

3D

GE_FBK4_3D_07

  -- RichardBates - 2012-02-22

Revision 12012-02-22 - RichardBates

Line: 1 to 1
Added:
>
>
META TOPICPARENT name="Modules"
These pages contain details of the characterization of single devices in the UK.

They include 3D and planar devices.

First off is some details on device characterization.

Device characterzation notes

  • Kate's notes from 2011
  • Additional notes
  • Prim list

Some notes on assembly, including wirebond program and design of Al plate, are given here for the single chip card

AssemblyDetails

3D

GE_FBK4_3D_07

Planar

MPI - ??

Micron - ??

-- RichardBates - 2012-02-22

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