MCMDPhotos < DetDev

DetDev Web>ResearchResults>MCMD>MCMDPhotos (2009-03-01, LarsEklund) (raw view)

---++ Photos at reception of Run 1 wafers

The photos were taken at reception of the wafers, but after wafers w09 and w14 had some of their ground planes bonded to the bias rails. Bond tests and tuning were done on the large metallised area at the bottom of w09. The bonds are visible in the photos. The bias bond locations are described in [[%ATTACHURL%/BiasBonds.pdf][BiasBonds.pdf.]]

*Full wafer views*
| | 6 um BCB | 12 um BCB |
| Electrical | [[%ATTACHURL%/w14_6umBCBElectrical_atReception.JPG][w14]], [[%ATTACHURL%/w15_6umBCBElectrical_atReception.JPG][w15]] | [[%ATTACHURL%/w08_12umBCBElectrical_atReception.JPG][w08]], [[%ATTACHURL%/w09_12umBCBElectrical_atReception.JPG][w09]] |
| Mechanical | [[%ATTACHURL%/w17_6umBCBMechanical_atReception.JPG][w17]], [[%ATTACHURL%/w18_6umBCBMechanical_atReception.JPG][w18]], [[%ATTACHURL%/w19_6umBCBMechanical_atReception.JPG][w19]] | [[%ATTACHURL%/w04_12umBCBMechanical_atReception.JPG][w04]], [[%ATTACHURL%/w05_12umBCBMechanical_atReception.JPG][w05]], [[%ATTACHURL%/w16_12umBCBMechanical_atReception.JPG][w16]] |

*Close-up views on a few sensors on w14*

[[%ATTACHURL%/meshGNDPlane_w14_X3Y2.JPG][Meshed GND plane, full view]]

[[%ATTACHURL%/meshGNDPlane_w14_X0Y1.JPG][Bias bond, close-up]]

[[%ATTACHURL%/meshGNDPlane_w14_X4Y1.JPG][Meshed GND plane, top half]]

[[%ATTACHURL%/meshGNDPlane_w14_X4Y2.JPG][Meshed GND plane, full view]]

[[%ATTACHURL%/solidGNDPlane_w14_X3Y1.JPG][Solid GND plane, top half]]

[[%ATTACHURL%/triGNDPlane_w14_X3Y0.JPG][Triangular GND plane, full view]]

*Close-up views on a few features on w14*

Ground planes: [[%ATTACHURL%/solidGNDPlane.jpg][solid]], [[%ATTACHURL%/meshedGNDPlane.jpg][meshed]], [[%ATTACHURL%/meshedGNDPlane_withBondPad2.jpg][meshed (bond pad)]]

Bias and guard ring connections: [[%ATTACHURL%/biasGuardRings.jpg][bias and guard rings]], [[%ATTACHURL%/biasRingVia_zoom.JPG][bias ring via]], [[%ATTACHURL%/biasBonds_tri.jpg][bias bond (triangular)]], [[%ATTACHURL%/meshedGNDPlane_withBondPad.jpg][bias bond (meshed)]]

Strip connections: [[%ATTACHURL%/stripPadConnections.jpg][overview]], [[%ATTACHURL%/stripPadConnections_zoom1.jpg][zoom 1]], [[%ATTACHURL%/stripPadConnections_zoom2.jpg][zoom 2]], [[%ATTACHURL%/stripPadConnections_zoom3.jpg][zoom 3]], [[%ATTACHURL%/bondPad.jpg][bond pad]], [[%ATTACHURL%/doubleVias.jpg][double vias]]

Bias resistor connections: [[%ATTACHURL%/biasResVias.jpg][resistor via]], [[%ATTACHURL%/biasResVia_zoom.jpg][zoom]]

A set of lines with decreasing line width and spacing were put on the mask to assess the resolution of the process. Starting with 10 lines of 5 um line width and spacing, increasing with 5 um for each set of lines. As seen in the [[%ATTACHURL%/lineResolution.jpg][overview picture]] all lines down to 10 um line width and spacing were correctly reproduced. However, the smallest pitch region became merged into one solid metallisation as can be seen in the [[%ATTACHURL%/lineResolution_zoom.jpg][close-up]].

-- Main.LarsEklund - 16 Dec 2008

Attachments

Topic attachments
I	Attachment	History	Action	Size	Date	Who
jpg	biasBonds_mesh.jpg	r1	manage	1939.0 K	2008-11-21 - 18:14	LarsEklund
jpg	biasBonds_tri.jpg	r1	manage	1769.3 K	2008-11-21 - 18:14	LarsEklund
jpg	biasGuardRings.jpg	r1	manage	1950.0 K	2008-11-21 - 18:14	LarsEklund
jpg	biasResVia_zoom.jpg	r1	manage	2221.3 K	2008-11-21 - 18:42	LarsEklund
jpg	biasResVias.jpg	r1	manage	1901.1 K	2008-11-21 - 18:15	LarsEklund
jpg	biasRingVia_zoom.JPG	r1	manage	1967.0 K	2008-11-21 - 18:43	LarsEklund
jpg	bondPad.jpg	r1	manage	1897.3 K	2008-11-21 - 18:16	LarsEklund
jpg	doubleVias.jpg	r1	manage	1873.4 K	2008-11-21 - 18:16	LarsEklund
jpg	lineResolution.jpg	r1	manage	2707.7 K	2008-11-21 - 18:16	LarsEklund
jpg	lineResolution_zoom.jpg	r1	manage	2238.2 K	2008-11-21 - 18:16	LarsEklund
jpg	meshGNDPlane_w14_X0Y1.JPG	r1	manage	1523.3 K	2008-11-21 - 15:31	LarsEklund
jpg	meshGNDPlane_w14_X3Y2.JPG	r1	manage	2120.5 K	2008-11-21 - 15:31	LarsEklund
jpg	meshGNDPlane_w14_X4Y1.JPG	r1	manage	1977.7 K	2008-11-21 - 15:32	LarsEklund
jpg	meshGNDPlane_w14_X4Y2.JPG	r1	manage	1307.7 K	2008-11-21 - 15:32	LarsEklund
jpg	meshedGNDPlane.jpg	r1	manage	1771.8 K	2008-11-21 - 18:17	LarsEklund
jpg	meshedGNDPlane_withBondPad.jpg	r1	manage	1755.0 K	2008-11-21 - 18:17	LarsEklund
jpg	meshedGNDPlane_withBondPad2.jpg	r1	manage	1874.4 K	2008-11-21 - 18:17	LarsEklund
jpg	solidGNDPlane.jpg	r1	manage	1707.4 K	2008-11-21 - 18:17	LarsEklund
jpg	solidGNDPlane_w14_X3Y1.JPG	r1	manage	2101.8 K	2008-11-21 - 15:43	LarsEklund
jpg	stripPadConnections.jpg	r1	manage	2016.9 K	2008-11-21 - 18:18	LarsEklund
jpg	stripPadConnections_zoom1.jpg	r1	manage	1871.6 K	2008-11-21 - 18:18	LarsEklund
jpg	stripPadConnections_zoom2.jpg	r1	manage	1982.4 K	2008-11-21 - 18:18	LarsEklund
jpg	stripPadConnections_zoom3.jpg	r1	manage	2468.9 K	2008-11-21 - 18:18	LarsEklund
jpg	triGNDPlane_w14_X3Y0.JPG	r1	manage	2165.5 K	2008-11-21 - 15:43	LarsEklund
jpg	w04_12umBCBMechanical_atReception.JPG	r1	manage	2386.5 K	2008-11-21 - 12:21	LarsEklund
jpg	w05_12umBCBMechanical_atReception.JPG	r1	manage	2448.2 K	2008-11-21 - 12:21	LarsEklund
jpg	w08_12umBCBElectrical_atReception.JPG	r1	manage	2381.8 K	2008-11-21 - 12:24	LarsEklund
jpg	w09_12umBCBElectrical_atReception.JPG	r1	manage	2381.0 K	2008-11-21 - 12:24	LarsEklund
jpg	w14_6umBCBElectrical_atReception.JPG	r1	manage	2357.0 K	2008-11-21 - 12:24	LarsEklund
jpg	w15_6umBCBElectrical_atReception.JPG	r1	manage	2338.5 K	2008-11-21 - 12:24	LarsEklund
jpg	w16_12umBCBMechanical_atReception.JPG	r1	manage	2331.5 K	2008-11-21 - 12:24	LarsEklund
jpg	w17_6umBCBMechanical_atReception.JPG	r1	manage	2367.5 K	2008-11-21 - 12:25	LarsEklund
jpg	w18_6umBCBMechanical_atReception.JPG	r1	manage	2350.4 K	2008-11-21 - 12:25	LarsEklund
jpg	w19_6umBCBMechanical_atReception.JPG	r1	manage	2412.7 K	2008-11-21 - 12:25	LarsEklund

Topic revision: r7 - 2009-03-01 - LarsEklund

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