Difference: MCMDYield (1 vs. 4)
Revision 42009-01-19 - LarsEklund
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Via yield measurements of Run 1Measurements of w04 (12 um BCB, mechanical) | ||||||||
Revision 32009-01-19 - LarsEklund
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Via yield measurements of Run 1Measurements of w04 (12 um BCB, mechanical) | ||||||||
Revision 22008-12-17 - LarsEklund
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Via yield measurements of Run 1Measurements of w04 (12 um BCB, mechanical) | ||||||||
Revision 12008-12-16 - LarsEklund
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Via yield measurements of Run 1Measurements of w04 (12 um BCB, mechanical)Probing double vias on same pad: 24 sensors * 4 pads * 2 vias = 192 vias No via failures observed Measurement offset: 2.3 ohm (both needles on the same pad) Measured resistance: average = 4.5 ohm, sigma = 0.65 Probing the two vias to the bias rail: 26 sensors * 2 vias = 52 vias No via failures observed Measurement offset: 2.3 ohm (both needles on the same pad) Measured resistance: average = 17.5 ohm, sigma = 0.66 Cp-Rp measurement: Checking for opens and shorts 26 sensors * 120 vias = 3120 vias (no opens seen) 26 sensors * 60 pairs = 1560 pairs (no shorts seen) -- LarsEklund - 16 Dec 2008 | |||||||
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