Difference: MCMD (30 vs. 31)
Revision 312010-07-21 - LarsEklund
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Thin film hybrid in MCM-D technology | ||||||||
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Specification of first version
Photos at reception of first thin film hybrid batch | ||||||||
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Study of the PWR-GND short | |||||||
Post processing of sensor wafer: Run 1Processing on electrical and mechanical grade sensor wafers to investigate the influence on the sensor performance. The processing involved a single metal layer, with the cross-section shown in the figure below. | ||||||||
View topic | History: r33 < r32 < r31 < r30 | More topic actions...
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