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> > | 14/7/2012
2 Green chips sent to glasgow for wafer probing
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28/5/2012 4 more single chips and first quad assemblied. | ||||||||
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After the first Flip-Chip of 6 single assmeblies we have 32 die reminaing. 6 were damaged during the flip-chip process and will be investigated. | ||||||||
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