Actions from last meeting: 1. PJD: Prepare irradiation programme to include irradiation of AC-coupled detectors, singles with and without zig-zag biasing, 200um thick sensors to be able to make “realistic” measurements. Contact Anna Macchiolo to discuss programme. Present at meeting on 26/5; Postponed to next meeting. 2. JL: To circulate mil-spec document for developing HASS for bump-bonding and other aspects of module construction. 3. CMB: To get Cr UBM wafers sent to Glasgow for I-V tests. DONE 4. JM: To check tested FE-I4 wafer stock and confirm if we have two tested wafers for module production as requested by RLB. 5. CMB: To order 10 CP6 and discuss with Micron when we have to define how many we want with UBM. 6. CMB/RLB/PJD: Meet and prepare plans for quads and singles for module construction, radiation programme and multi-module tests. Report at the next meeting; Postponed to next meeting |