Difference: PixelWeekly (41 vs. 42)

Revision 422016-06-16 - JohnLipp

Line: 1 to 1
 
META TOPICPARENT name="Meetings__Wikis"

Pixel Weekly

Line: 8 to 8
  In general, indico pages are listed in: https://indico.cern.ch/categoryDisplay.py?categId=547
Date Indico page Other notes/docs (e.g. uploads to PUUKA Twiki)
Changed:
<
<
2016.06.09 https://indico.cern.ch/event/541129/  
2016.05.26 https://indico.cern.ch/event/536349/

Actions from last meeting:

1. PJD: Prepare irradiation programme to include irradiation of AC-coupled detectors, singles with and without zig-zag biasing, 200um thick sensors to be able to make “realistic” measurements. Contact Anna Macchiolo to discuss programme. Present at meeting on 26/5; Postponed to next meeting.

2. JL: To circulate mil-spec document for developing HASS for bump-bonding and other aspects of module construction.

3. CMB: To get Cr UBM wafers sent to Glasgow for I-V tests. DONE

4. JM: To check tested FE-I4 wafer stock and confirm if we have two tested wafers for module production as requested by RLB.

5. CMB: To order 10 CP6 and discuss with Micron when we have to define how many we want with UBM.

6. CMB/RLB/PJD: Meet and prepare plans for quads and singles for module construction, radiation programme and multi-module tests. Report at the next meeting; Postponed to next meeting

2016.05.12 https://indico.cern.ch/event/528140/  
>
>
2016.06.16 https://indico.cern.ch/event/544157/ Meeting focussed on scoping new sensor design for RD53 (overview of recent previous designs given by Craig)
2016.06.09 https://indico.cern.ch/event/541129/  
2016.05.26 https://indico.cern.ch/event/536349/

Actions from last meeting:

1. PJD: Prepare irradiation programme to include irradiation of AC-coupled detectors, singles with and without zig-zag biasing, 200um thick sensors to be able to make “realistic” measurements. Contact Anna Macchiolo to discuss programme. Present at meeting on 26/5; Postponed to next meeting.

2. JL: To circulate mil-spec document for developing HASS for bump-bonding and other aspects of module construction.

3. CMB: To get Cr UBM wafers sent to Glasgow for I-V tests. DONE

4. JM: To check tested FE-I4 wafer stock and confirm if we have two tested wafers for module production as requested by RLB.

5. CMB: To order 10 CP6 and discuss with Micron when we have to define how many we want with UBM.

6. CMB/RLB/PJD: Meet and prepare plans for quads and singles for module construction, radiation programme and multi-module tests. Report at the next meeting; Postponed to next meeting

2016.05.12 https://indico.cern.ch/event/528140/  
 
2016.02.04 https://indico.cern.ch/event/493370/

1. Update on Pixel readout ,Andeas

2. Irradiation programme, Paul -discussion

3. Multi-module status, Ilya

4. Brief updates

1. Module production, Richard

2. Micron update, Craig

3. Itk week talks

5. AOB

Changed:
<
<
2016.01.21 https://indico.cern.ch/event/486293/

1. Report on thinned modules and module production, Richard, 20mins

2. Module results, Ilya, 20mins

3. Status of hybrid production, Sneha, 10mins

4. Status of ASIC testing, John, 10mins 5. AOB

2015.11.12 https://indico.cern.ch/e/461536  
>
>
2016.01.21 https://indico.cern.ch/event/486293/

1. Report on thinned modules and module production, Richard, 20mins

2. Module results, Ilya, 20mins

3. Status of hybrid production, Sneha, 10mins

4. Status of ASIC testing, John, 10mins 5. AOB

2015.11.12 https://indico.cern.ch/e/461536  
 
2015.10.15 https://indico.cern.ch/e/455163  
2015.10.01 https://indico.cern.ch/e/450601  
2015.09.03 http://indico.cern.ch/e/442908 .
2015.08.20 http://indico.cern.ch/e/440077

Agenda:

  1. Module assembly Ilya/Paul
  2. Hybrid production: Sneha
  3. Followup on encapsulation: Kirk
  4. Reliability workshop report part 2: Kirk
2015.08.06 https://indico.cern.ch/event/436949/

Agenda

  1. Status of module production: Richard
  2. Report on module assembly: Paul/Ilya
  3. Discussion of flex and tape designs: Ilya/Sneha
  4. Review of parylene studies: Kirk
  5. Results of parylene studies: Paul
  6. Summary of Reliability & Risk workshop: Kirk
Changed:
<
<
2015.07.09 https://indico.cern.ch/event/408121/

Agenda

  1. Report on module assembly: Paul
  2. Status of module mini-production: Craig (20mins including discussion)
  3. AOB
>
>
2015.07.09 https://indico.cern.ch/event/408121/

Agenda

  1. Report on module assembly: Paul
  2. Status of module mini-production: Craig (20mins including discussion)
  3. AOB
 
2015.06.18 http://indico.cern.ch/e/403008  
Changed:
<
<
2015.05.28 https://indico.cern.ch/event/397116/

11:15-13:00

Agenda

  1. Module assembly of CMS Phase-I pixel upgrade: Kirk (20mins)
  2. Module mini-production: Craig (20mins including discussion)
  3. UK preparations for module assembly: Craig (30mins including discussion)
  4. Report on high rate bump bonding: Richard (20mins including discussion)

Items 3 & 4 will be reported at tomorrow's ITk module meeting. The indico page is at: https://indico.cern.ch/event/396129/

2015.05.07 https://indico.cern.ch/event/391195/
  1. Update on thinned module bump bonding, Richard 15mins
  2. Update on RAL BB, John L, 15mins
  3. Status of multimodule testing, Richard/Sneha, 15mins
  4. Hybrid to module assembly work, Ilya/Paul, 15mins
  5. AOCB
  1. Update on thinned module bump bonding, Richard Bates
    See Richard Slides.
    Richard presented an update on thinned module assembly. This focused on work at Advacam on flip chip of assembly. Several different techniques have been looked at: Au UBM to replace current Advacam transition metal UBM, solder on sensors to give a solder-solder bond and a new reflow method: "Advacam reflow method". 5 samples with 100um thick readout chips and 300um single chip sensors, some have SCL and some do not. Good bump yields with solder-solder and also Advacam reflow method.
    More samples being made.
    Need extend Advacam reflow method to quads and check it is compatible with large scale production.
    Samples will be subjected to thermal cycling but it was pointed out that glues had failed on strip samples at -50C. Test samples will be thermally cycled before the samples.
  2. Module production exercise
    See Richard slides (last slide)
    Richard reported that at the pixel design group large scale bump bonding was discussed (https://indico.cern.ch/event/392019/). The bump bonding capacity needs to be understood to support the case for increasing the pixel area to a 5th and 6th layer. The aim is to place orders with a number of vendors: IZM, Selex, Advacam/Cea-Leti, HPK and see if the meet required production rates and quality. It would be better to have more vendors, around 6 so that we have a choice rather than being limited to using the current 4.
    Daniella pointed out that RTI have worked on bump bonding for CMS and should be considered. Vitaliy Fadyev is the currently the contact for them. Daniella will contact Vitality regarding RTI.
    RAL have been considered as small site that could work on the inner layer given their limited resources. However, John reported that the following discussions, he had been given the go ahead to look at developing 300mm capability.
    We need to consider module production, hybrid assembly and final testing.
    The programme of bump bonding needs to be complete by end of the year so that decisions can be made on the layout. The aim from the UK is make and test 50 assemblies with CEA-Leti & Advacam, and also a similar number with RAL. Craig will organise a meeting with Craig, John L, Richard and Paul to discus the programme for this.
  3. Update on RAL BB, John Lipp
    See John's slides
    John gave an update on the studies to understand the quality of the bumps. In the "old" daisy chain samples that included Au in the UBM, intermetallics were observed, confirming that removing the Au from the UBM was correct. The results from the module that did not have Au in the UBM showed no evidence of intermetallics. The UBM and inter-bump interface appear to be good. The remaining possible problems are that the parallelism of the FE-I4 and sensor may not be good enough or there may have been Cr contamination from resputtering. If it is the resputtering, this has now been fixed. Next step is to make more modules and evaluate them.
  4. Multi-module testing, Kenny
    See Kenny' slides
    Kenny showed the progress with the multimodule testing system. After some teething problems with connections the system is now setup to test up to 16 chips = 4 quads. This will start with modules on PCBs but will move to testing modules with flex hybrids on the half disk. The serial powering system is up and runnning with SCTDAQ and an interlock system.
  5. Hybrid mounting, Paul
    2 quads ready for sending to Glasgow, will be sent up together with the assembly jigs.
    Glasgow will send 6 FR4 populated hybrids to Liverpool.
    Richard reported that hybrids from Flexible technologies had cracks. This appears to be due to using a flexible solder resist rather than polyamide.
    There was a brief discussion on using rice paper as a replacement for the gluing stencil. Ilya will be asked to report on this at the next meeting.
    Kirk mentioned his experience with using a rubber stamp method for glue dispensing. He will report on this at the next meeting .
  6. AOB
    Paul reported that Sussane and Wuppertal cofirmed that we will get 40 untested PPSP chips. This will be in August/September.

Paul Dervan noted: This was the glue/paint that failed at about ~40C: http://uk.rs-online.com/web/p/conductive-adhesives/1863593/

>
>
2015.05.28 https://indico.cern.ch/event/397116/

11:15-13:00

Agenda

  1. Module assembly of CMS Phase-I pixel upgrade: Kirk (20mins)
  2. Module mini-production: Craig (20mins including discussion)
  3. UK preparations for module assembly: Craig (30mins including discussion)
  4. Report on high rate bump bonding: Richard (20mins including discussion)

Items 3 & 4 will be reported at tomorrow's ITk module meeting. The indico page is at: https://indico.cern.ch/event/396129/

2015.05.07 https://indico.cern.ch/event/391195/
  1. Update on thinned module bump bonding, Richard 15mins
  2. Update on RAL BB, John L, 15mins
  3. Status of multimodule testing, Richard/Sneha, 15mins
  4. Hybrid to module assembly work, Ilya/Paul, 15mins
  5. AOCB
  1. Update on thinned module bump bonding, Richard Bates
    See Richard Slides.
    Richard presented an update on thinned module assembly. This focused on work at Advacam on flip chip of assembly. Several different techniques have been looked at: Au UBM to replace current Advacam transition metal UBM, solder on sensors to give a solder-solder bond and a new reflow method: "Advacam reflow method". 5 samples with 100um thick readout chips and 300um single chip sensors, some have SCL and some do not. Good bump yields with solder-solder and also Advacam reflow method.
    More samples being made.
    Need extend Advacam reflow method to quads and check it is compatible with large scale production.
    Samples will be subjected to thermal cycling but it was pointed out that glues had failed on strip samples at -50C. Test samples will be thermally cycled before the samples.
  2. Module production exercise
    See Richard slides (last slide)
    Richard reported that at the pixel design group large scale bump bonding was discussed (https://indico.cern.ch/event/392019/). The bump bonding capacity needs to be understood to support the case for increasing the pixel area to a 5th and 6th layer. The aim is to place orders with a number of vendors: IZM, Selex, Advacam/Cea-Leti, HPK and see if the meet required production rates and quality. It would be better to have more vendors, around 6 so that we have a choice rather than being limited to using the current 4.
    Daniella pointed out that RTI have worked on bump bonding for CMS and should be considered. Vitaliy Fadyev is the currently the contact for them. Daniella will contact Vitality regarding RTI.
    RAL have been considered as small site that could work on the inner layer given their limited resources. However, John reported that the following discussions, he had been given the go ahead to look at developing 300mm capability.
    We need to consider module production, hybrid assembly and final testing.
    The programme of bump bonding needs to be complete by end of the year so that decisions can be made on the layout. The aim from the UK is make and test 50 assemblies with CEA-Leti & Advacam, and also a similar number with RAL. Craig will organise a meeting with Craig, John L, Richard and Paul to discus the programme for this.
  3. Update on RAL BB, John Lipp
    See John's slides
    John gave an update on the studies to understand the quality of the bumps. In the "old" daisy chain samples that included Au in the UBM, intermetallics were observed, confirming that removing the Au from the UBM was correct. The results from the module that did not have Au in the UBM showed no evidence of intermetallics. The UBM and inter-bump interface appear to be good. The remaining possible problems are that the parallelism of the FE-I4 and sensor may not be good enough or there may have been Cr contamination from resputtering. If it is the resputtering, this has now been fixed. Next step is to make more modules and evaluate them.
  4. Multi-module testing, Kenny
    See Kenny' slides
    Kenny showed the progress with the multimodule testing system. After some teething problems with connections the system is now setup to test up to 16 chips = 4 quads. This will start with modules on PCBs but will move to testing modules with flex hybrids on the half disk. The serial powering system is up and runnning with SCTDAQ and an interlock system.
  5. Hybrid mounting, Paul
    2 quads ready for sending to Glasgow, will be sent up together with the assembly jigs.
    Glasgow will send 6 FR4 populated hybrids to Liverpool.
    Richard reported that hybrids from Flexible technologies had cracks. This appears to be due to using a flexible solder resist rather than polyamide.
    There was a brief discussion on using rice paper as a replacement for the gluing stencil. Ilya will be asked to report on this at the next meeting.
    Kirk mentioned his experience with using a rubber stamp method for glue dispensing. He will report on this at the next meeting .
  6. AOB
    Paul reported that Sussane and Wuppertal cofirmed that we will get 40 untested PPSP chips. This will be in August/September.

Paul Dervan noted: This was the glue/paint that failed at about ~40C: http://uk.rs-online.com/web/p/conductive-adhesives/1863593/

 
2015.04.16 https://indico.cern.ch/event/388245/
  1. Hybrid to module assembly and electrical testing of modules with flex hybrids: Ilya/Paul
  2. Report on In bump bonding at RAL: John Lipp
  3. Summary from DAQ meeting: Craig
  4. Input to RD53 sensor discussion: All
  5. AUW talks: All
Changed:
<
<
2015.03.19 https://indico.cern.ch/event/382297/

11.15.

Agenda

  1. Module assembly and flex status: Paul/Ilya
  2. Multi-module test status: Richard
  3. Stuff: USBpix order, PPSP chip, PixelFest, DAQ meeting
  4. AoB

Can groups send Craig information on what USBPix systems you have and whether they are working or not. Andreas Korn is organising an order for new MIO3 and MMC3 cards.

>
>
2015.03.19 https://indico.cern.ch/event/382297/

11.15.

Agenda

  1. Module assembly and flex status: Paul/Ilya
  2. Multi-module test status: Richard
  3. Stuff: USBpix order, PPSP chip, PixelFest, DAQ meeting
  4. AoB

Can groups send Craig information on what USBPix systems you have and whether they are working or not. Andreas Korn is organising an order for new MIO3 and MMC3 cards.

 
2015.03.05 https://indico.cern.ch/event/368657/ 11:15am
2015.02.25 https://indico.cern.ch/e/373270 11:15am
2015.01.22  

UK WP1: Meeting Summary
22/01/15
Meeting Commenced: 11:20
Present:
Liverpool: P.Dervan, M. Milovanovic, I. Tsurin
Oxford: D. Bortoletto
Glasgow: K. Doonan
RAL: J. Matterson, I. Wilmut, J. Lipp
Manchester: J. Pater, G. Miller
Apologies: C. Buttar, C. Da Via, V O’Shea
1. Summary of the meeting:
Liverpool:
• Mike, the Liverpool wire bonder has had an operation. He will be off work for three weeks. So there was no news on the sensors/module side of things.
• The assembly jig is nearly finished (see the slides from Ilya on the indico site). Quotes from three companies have just been received for the glue stencils. Would everything is ready we would like to have a review of the process and jig.
• Paul has been in touch with the German groups about the PSPP chip. They are making a new submission at the end of February. The UK would like some (including the strip
group). We will go and visit the German groups in the next month or so.
• If we redesign the hybrid with the PSPP chip the tapes and EOS card will need to be modified. Jo mentioned that an email had just been sent around about a face to face
meeting about the EOS card. The PSPP has now been included.


Manchester:
• Jo introduced Graham Miller. He is Manchester’s new electrical engineer.
• Jo mentioned the face to face EOS meeing. This will happen in early February. A doodle pole has been sent around.
• There will be a test beam at DESY around Easter time. The beam will be setup for 3D devices. Do you want to send the AC devices?

Oxford:
• A probe station has been ordered.
• The new lab will be ready around May time.
• Lots of work has been done on the CMOS sensors. These will be irradiated next Tuesday in Birmingham.

Glasgow:
• Tape tests will happen soon.
• Kenny has been working on the reconstruction of test beam data for sensors with different geometries

RAL:
• Wafer (ASIC) probing continues.
• More wafers are needed.
• Stages need to be ordered for the module mounting system
• Bump bonding of CP6 wafers is on going.
• The GDS file for the top metal is needed.
• Work on QUAD bump bonding is progressing.
• The modules with low bump yield are being investigated.
• A low deposition system is being looked at, to reduce the out-gassing.
• John Lipp requested that the next few meeting were announced in advance. To help with planning.

AOB:
• There is a RCE/COB workshop in Oxford next week.
• The next few meeting will be at 11:15am on the 5th Feb, 19th Feb and 5th March.

 
This site is powered by the TWiki collaboration platform Powered by PerlCopyright © 2008-2020 by the contributing authors. All material on this collaboration platform is the property of the contributing authors.
Ideas, requests, problems regarding TWiki? Send feedback