| Agenda: - Freiburg talks: The list i sent to Paolo after last weeks discussion can be found below.
- TB analysis status and SLAC discussion
- Status of RAL In-bumped module
- Flex and tape status
- Update on Cea-Leti production
- AOB
List sent to Paolo after last weeks discussion 1. Sensors Results from characterisation of quad sensors. We got some nice data at DESY with unirradiated and also with an irradiated sensors. Results from characterisation of pixel sensors with different geometries As for the quads, we have some nice data from the Feb DESY TB run with unirradiated and irradiated sensors. 2. Modules Interconnect developments This would cover work with Cea-Leti, we have first results on using the backside compensation, status of bump-bonding at Advacam. Status of In bump bonding at RAL This would cover an update on the In bump bonding at RAL. We have the first module from RAL and would hope to have results from characterising. It may be this could be merged with the more general interconnect developments. Depending on overlaps with the other meetings, we could contribute a summary of quad and different geometries in case as there may be people who do not see the talks in the sensor sessions. Flex development We have a prototype flex on thin FR4 and hope to have bonded chips to it and characterised it by Freiburg. Wafer probing We can provide an update on UK work in this area. |
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