Difference: Our_FEI4_wafers (8 vs. 9)

Revision 92013-06-13 - RichardBates

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META TOPICPARENT	name="Modules"

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At present we have two FE-I4 wafers at VTT. A third is on its way. Two wafers belong to the UK and the third to MPI. The plan is that MPI and the UK share the cost of the FE-I4A UBM and bump masks.

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There are a number of FE-I4 wafers A and B that belong to the UK for the ATLAS module upgarde project.

Wafers

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FE-I4A wafers

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V6ABC1H

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V6ABC1H - Processed at VTTat 200um thickness

V5ABC2H - returned

VZABC8H

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VBABAXH

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VBABAXH - Processed at VTT full thickness

V2AQMLH

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FE-I4B wafers

VMB8WDH - for LETI u-bump depositio, technology run 1

V6B8WUH - for LETI u-bump deposition, technology run 1

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ABPJXGH - For LETI technology run 2 (wafer map available and to be uploaded)

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VWB6IVH - Processing at Advacamat full thickness

-- AndrewStewart - 2012-07-31 \ No newline at end of file

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