Difference: Our_FEI4_wafers (15 vs. 16)

Revision 162013-11-27 - RichardBates

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META TOPICPARENT	name="Modules"

There are a number of FE-I4 wafers A and B that belong to the UK for the ATLAS module upgarde project.

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FE-I4B wafers

Changed:

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VMB8WDH - for LETI u-bump deposition, technology run 1

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VMB8WDH - For LETI u-bump deposition, technology run 1

Changed:

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V6B8WUH - for LETI u-bump deposition, technology run 1

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V6B8WUH - For LETI u-bump deposition, technology run 1

Changed:

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VUAYCRH - for LETI technology run 2 (Broke during processing)

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VUAYCRH - For LETI technology run 2 (Broke during processing)

ABPJXGH - For LETI technology run 2

Changed:

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V7B8WTH - for LETI technology run 3

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V7B8WTH - For LETI technology run 3

VKB8WFH - For LETI technology run 3

Added:

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VYB8XJH - For LETI technology run 4

VTB8W7H - For LETI technology run 4

VPB8WBH - For LETI technology run 5

VIB62GH - For LETI technology run 5

VEB6NSH - For LETI technology extra full thickness No. 1

VJB8WGH - For LETI technology extra full thickness No. 2

VUB6NCH - For LETI technology extra full thickness No. 3

VWB6IVH - Processing at Advacam at full thickness

Added:

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- FE-I4B wafers in Edinburgh to probe and use for module build

VZBSDRH
VZBSBSH
V1BSDPH
VGBSF8H

- FE-I4B wafers in Glasgow to probe and use for module build

VEBSAVH - probe commissioning

VQBSEHH

VUBSAFH

V0BSDQH

-- AndrewStewart - 2012-07-31

META FILEATTACHMENT	attachment="wafer-metal.gds.zip" attr="" comment="FE-I4A Top metal layer GDS (zipped)" date="1373607502" name="wafer-metal.gds.zip" path="wafer-metal.gds.zip" size="2281227" stream="wafer-metal.gds.zip" tmpFilename="/usr/tmp/CGItemp51787" user="RichardBates" version="1"

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