Difference: Face_to_face_meetings (4 vs. 5)

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Project close-out and kick-off meeting

Wednesday 24th and Thursday 25th April 2013

Glasgow

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19th September 2013

Liverpool

INDICO agenda, slides etc | Vidyo Portal

Wednesday 24th and Thursday 25th April 2013 - Project close-out and kick-off meeting

Glasgow

  Link to the agenda page:

https://indico.cern.ch/conferenceDisplay.py?confId=247097

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Monday 22nd Feb 2012

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Monday 22nd Feb 2012

  Glasgow
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  • Quad readout development: Jo Pater and Simon Brown
  • Discussion of future project: Craig Buttar
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Wednesday 16th March 2011

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Wednesday 16th March 2011

  Manchester
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  Talks given by:
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Craig Buttar: Introduction

Gianluigi Casse: Planar sensors IBL ansd beyond

Richard Bates: Modules

Tim Greenshaw: Layout and Mechanics

John Matheson: MCM_d at RAL

John Lipp: Bump bodning progress at RAL

Jo Pater: Towards a 4-chip module

Tuesday 23rd November 2010

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  • Craig Buttar: Introduction
  • Gianluigi Casse: Planar sensors IBL ansd beyond
  • Richard Bates: Modules
  • Tim Greenshaw: Layout and Mechanics
  • John Matheson: MCM_d at RAL
  • John Lipp: Bump bonding progress at RAL
  • Jo Pater: Towards a 4-chip module

Tuesday 23rd November 2010

  Manchester
Line: 58 to 57
  Talks given by:
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Craig Buttar: Introduction

Cinzia Da Via: 3D sensors

Gianluigi Casse: Planar Sensors

Richard Bates: Modules

Timothy Greenshaw: Layout and Mechanics

John Lipp: Bump-bonding

Richard Plackett: Bump-bonding

Philip Allport: ATLAS upgrade organisation: IT-SC

Cinzia Da Via: IBL sensor prototyping programme

Philip Clark: Simulation

Wednesday 22 September 2010

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  • Craig Buttar: Introduction
  • Cinzia Da Via: 3D sensors
  • Gianluigi Casse: Planar Sensors
  • Richard Bates: Modules
  • Timothy Greenshaw: Layout and Mechanics
  • John Lipp: Bump-bonding
  • Richard Plackett: Bump-bonding
  • Philip Allport: ATLAS upgrade organisation: IT-SC
  • Cinzia Da Via: IBL sensor prototyping programme
  • Philip Clark: Simulation

Wednesday 22 September 2010

  Glasgow
Line: 91 to 81
  Talks given by:
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Craig Buttar: Introduction

Cinzia Da Via: Status of 3D sensors and plans

Gianluigi Casse: Status of planar sensor development and plans

Anthony Affolder: Report on planar pixels meeting

Timothy Greenshaw: Layout studies and plans

Tim Jones: Report from LBL workshop and plans for mechanics

Mike Tyndel: Report on interconnects

Richard Plackett: Report on LHCb VELO Upgrade and Timepix development

Richard Bates: Plans for single-chip module

>
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  • Craig Buttar: Introduction
  • Cinzia Da Via: Status of 3D sensors and plans
  • Gianluigi Casse: Status of planar sensor development and plans
  • Anthony Affolder: Report on planar pixels meeting
  • Timothy Greenshaw: Layout studies and plans
  • Tim Jones: Report from LBL workshop and plans for mechanics
  • Mike Tyndel: Report on interconnects
  • Richard Plackett: Report on LHCb VELO Upgrade and Timepix development
  • Richard Bates: Plans for single-chip module
 
 
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