| |
| META TOPICPARENT |
name="Tasks" |
The connective task has two main areas of work, TSV and flip-chip bonding development. |
| | 21082014_Indium-DanSmaranda.pdf
RCE System |
|
<
< | Bump yield studies performed in September 2014 by Kate Sexton |
| | All modules tuned to and operated at 3000e threshold, 10ToT @ 16ke reference charge. |
|
>
> | Tuning
Module 14-07-24_S2:
Tune to 3000e, 10ToT @ 16ke
14-07-24_S2_3000eTuning.pptx
Module 14-07-25_S4:
Tune to 3000e, 10ToT @ 16ke
14-07-25_S4_3000eTuning.pptx
Bump Yield Studies |
| |
Bump Yield assessed by performing Threshold Scans with and without sensor bias and performing source scans with Strontium-90 beta source and Americium-241 60keV gamma ray source. |
| |
| META FILEATTACHMENT |
attachment="21082014_Indium-DanSmaranda.pdf" attr="" comment="Bump Yield Studies by Richard Bates and Dan Smaranda 08/2014" date="1411652282" name="21082014_Indium-DanSmaranda.pdf" path="21082014_Indium-DanSmaranda.pdf" size="613055" user="KateDoonan" version="1" |
| META FILEATTACHMENT |
attachment="Indium-Characterisation_0914.pptx" attr="" comment="Bump yield studies by Kate Sexton" date="1411652373" name="Indium-Characterisation_0914.pptx" path="Indium-Characterisation_0914.pptx" size="593882" user="KateDoonan" version="1" |
| META FILEATTACHMENT |
attachment="Screen_Shot_2014-09-25_at_14.50.52.png" attr="" comment="IV Characteristics of Modules before and after processing" date="1411653108" name="Screen_Shot_2014-09-25_at_14.50.52.png" path="Screen Shot 2014-09-25 at 14.50.52.png" size="159806" user="KateDoonan" version="1" |
|
|
>
> |
| META FILEATTACHMENT |
attachment="14-07-24_S2_3000eTuning.pptx" attr="" comment="" date="1412174595" name="14-07-24_S2_3000eTuning.pptx" path="14-07-24_S2_3000eTuning.pptx" size="163126" user="KateDoonan" version="1" |
| META FILEATTACHMENT |
attachment="14-07-25_S4_3000eTuning.pptx" attr="" comment="" date="1412174628" name="14-07-25_S4_3000eTuning.pptx" path="14-07-25_S4_3000eTuning.pptx" size="157841" user="KateDoonan" version="1" |
|
Copyright © 2008-2025 by the contributing authors. All material on this collaboration platform is the property of the contributing authors.