Descriprtion of the water testing of ASICS at Glasgow ---++ Introduction The following is a decripton of the setup used to test wafers of ABCn ASICS at Glasgow. The setup uses a Cascade semi automaitc propbe station, with a cutosm built probe card. The probe card is connected to a PCB driver card, which sends signals and data to and from the PC. 2 NI cards are used for signalling, voltage sourced for power, multimeters for measuring the DACs and an adapted verstion of SCTDAQ is used for control software ---++ Hardware <table align="center" border="0"> <tbody> <tr> <td>TTi TSX3510P</td> <td>TTi CPX 2000</td> <td>Agilent 34401A</td> <td>Agilent 34401A</td> </tr> <tr> <td><img alt="" src="http://img811.imageshack.us/img811/3444/tsx1820.jpg" /></td> <td><img alt="" src="http://img232.imageshack.us/img232/7171/cpx400dpf280.jpg" /></td> <td><img width="282" alt="" src="http://img15.imageshack.us/img15/7791/34401aimage.jpg" height="172" /></td> <td><img width="337" alt="" src="http://img15.imageshack.us/img15/7791/34401aimage.jpg" height="158" /></td> </tr> <tr> <td>2.5V for ABCn</td> <td> 5.5V for Driver board Voltage for 80MHz clock source </td> <td>Meter for ABCn multiplexer ouput</td> <td>Meter for monitoring output of the ABCn analogue regulator</td> </tr> </tbody> </table> ---+++ Driver Card ---+++ <img alt="" src="http://img100.imageshack.us/img100/4201/clipboard01popopo.gif" /> <img width="317" alt="" src="http://img824.imageshack.us/img824/2125/img0730mm.jpg" height="393" /> ---++++++ Connections * 2 64 pin twist & flat cables * Connects the Driver card to the probe card * Supplies the LVDS, CMOS signals, control lines etc * DB9 -> 4 Banana leads * 2.5V provides ABCn power * ~4.5V for driver board (locally regulated). Taken to 3.3V, 2.5V & 2.0V by local regulators * Lemo 2 pin * Analogue output * Multiplexer out from ABCn to multimeter * Bandgap reference for Vreg on ABCn * 2 Large multi pin connectors * connected to NI cards in PC * PL7 * Analogue regulator output * To 2nd multimeter ---+++ Probe Card <img width="438" alt="" src="http://img821.imageshack.us/img821/4955/img1016v.jpg" height="583" /> <img width="335" alt="" src="http://img821.imageshack.us/img821/2111/clipboard01gggggg.gif" height="342" /> ---+++ Probe Station <img width="406" alt="Probe Station" src="http://img546.imageshack.us/img546/2120/img1017w.jpg" title="Probe Station" height="541" /> ---+++ NI Cards ---+++ Source & Multitmeters ---++ Software <img width="423" alt="" src="https://twiki.cern.ch/twiki/pub/Atlas/SCTUpDAQDown/waferGuiInAction.png" height="426" /> <img width="455" alt="" src="http://img854.imageshack.us/img854/6157/clipboard0111.png" height="425" /> * Root 5,26 * Visual Studio Express 2008 * Labview 8.6 * SCTDAQ Test Sequence * Digital Test Vectors * Check all registres can be written and sent back * Test token receive and send data * Same for other side of chip * Master mode with 80MHz clock * Stops at failure and flasgs as Bad (Red) * Analogue DACs via the multiplexer output * Analogue front end test * 2 point gain (1.5, 2 & 2.5 fC trim DACS @ 0) * Threshold scan at full range of trim DACS (2fC, trimDAC :@ max) ---++ Instructions * In root, .x Wafter.cpp * Loads STGUI.cpp 1 Test Bonded ASIC Test Die * Test Single chip (manual and move) 2. Test single ASIC * * Place single asic on chuck * Turn vacumn on * Align chip * Roate in Abhle * align in x and y * Find point of first contact * 2.5V source will draw xcurrent (~0.14A) * Over travel can be appklied up to 60 microns over first contact * Check for probe marks on each pad 3. Test wafer * * Place Wafer on chuck and vacum * align at this stage as best as possible x + y * Align wafer (max L + R points) * Align top left asic for x+y * Check if still in alignment for bottom right wafer * Test wafer option on software ---++++++ Notes Cuts for failures as follows: * Digital (Red) * Power (Blue) * Analog (Yellow) If 3 Digital fails in a row, wafer testing will fail
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Topic revision: r3 - 2011-11-01 - AndrewBlue
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