MCMD < DetDev

---+++ Wafer and sensor numbering scheme

The wafers are marked with sensor number at the wafer edge close to the larger straight section of the border. The individual sensors are labelled by their X and Y positions on the wafer. The classification of the wafers and the definition of the wafer number can be found in [[%ATTACHURL%/SensorNumbering.pdf][SensorNumbering.pdf]].

<img width="422" alt="Sensor number scheme" src="%ATTACHURL%/sensorOverviewNumbered.jpg" height="400" />
---+++ Photos at reception of Run 1 wafers

The photos were taken at reception of the wafers, but after wafers w09 and w14 had some of their ground planes bonded to the bias rails. Bond tests and tuning were done on the large metallised area at the bottom of w09. The bonds are visible in the photos. The bias bond locations are described in [[%ATTACHURL%/BiasBonds.pdf][BiasBonds.pdf.]]

*Full wafer views*
| | 6 &mu;m BCB | 12 &mu;m BCB |
| Electrical | [[%ATTACHURL%/w14_6umBCBElectrical_atReception.JPG][w14]], [[%ATTACHURL%/w15_6umBCBElectrical_atReception.JPG][w15]] | [[%ATTACHURL%/w08_12umBCBElectrical_atReception.JPG][w08]], [[%ATTACHURL%/w09_12umBCBElectrical_atReception.JPG][w09]] |
| Mechanical | [[%ATTACHURL%/w17_6umBCBMechanical_atReception.JPG][w17]], [[%ATTACHURL%/w18_6umBCBMechanical_atReception.JPG][w18]], [[%ATTACHURL%/w19_6umBCBMechanical_atReception.JPG][w19]] | [[%ATTACHURL%/w04_12umBCBMechanical_atReception.JPG][w04]], [[%ATTACHURL%/w05_12umBCBMechanical_atReception.JPG][w05]], [[%ATTACHURL%/w16_12umBCBMechanical_atReception.JPG][w16]] |

*Close-up views on a few sensors*

[[%ATTACHURL%/meshGNDPlane_w14_X3Y2.JPG][Meshed GND plane, full view]]

[[%ATTACHURL%/meshGNDPlane_w14_X0Y1.JPG][Bias bond, close-up]]

[[%ATTACHURL%/meshGNDPlane_w14_X4Y1.JPG][Meshed GND plane, top half]]

[[%ATTACHURL%/meshGNDPlane_w14_X4Y2.JPG][Meshed GND plane, full view]]

[[%ATTACHURL%/solidGNDPlane_w14_X3Y1.JPG][Solid GND plane, top half]]

[[%ATTACHURL%/triGNDPlane_w14_X3Y0.JPG][Triangular GND plane, full view]]

-- Main.LarsEklund - 21 Nov 2008

Attachments

Topic attachments
I	Attachment	History	Action	Size	Date	Who
pdf	BiasBonds.pdf	r1	manage	628.6 K	2008-11-21 - 15:28	LarsEklund
pdf	SensorNumbering.pdf	r1	manage	346.5 K	2008-11-21 - 15:23	LarsEklund
jpg	meshGNDPlane_w14_X0Y1.JPG	r1	manage	1523.3 K	2008-11-21 - 15:31	LarsEklund
jpg	meshGNDPlane_w14_X3Y2.JPG	r1	manage	2120.5 K	2008-11-21 - 15:31	LarsEklund
jpg	meshGNDPlane_w14_X4Y1.JPG	r1	manage	1977.7 K	2008-11-21 - 15:32	LarsEklund
jpg	meshGNDPlane_w14_X4Y2.JPG	r1	manage	1307.7 K	2008-11-21 - 15:32	LarsEklund
jpg	sensorOverviewNumbered.jpg	r1	manage	178.0 K	2008-11-21 - 15:25	LarsEklund
jpg	solidGNDPlane_w14_X3Y1.JPG	r1	manage	2101.8 K	2008-11-21 - 15:43	LarsEklund
jpg	triGNDPlane_w14_X3Y0.JPG	r1	manage	2165.5 K	2008-11-21 - 15:43	LarsEklund
jpg	w04_12umBCBMechanical_atReception.JPG	r1	manage	2386.5 K	2008-11-21 - 12:21	LarsEklund
jpg	w05_12umBCBMechanical_atReception.JPG	r1	manage	2448.2 K	2008-11-21 - 12:21	LarsEklund
jpg	w08_12umBCBElectrical_atReception.JPG	r1	manage	2381.8 K	2008-11-21 - 12:24	LarsEklund
jpg	w09_12umBCBElectrical_atReception.JPG	r1	manage	2381.0 K	2008-11-21 - 12:24	LarsEklund
jpg	w14_6umBCBElectrical_atReception.JPG	r1	manage	2357.0 K	2008-11-21 - 12:24	LarsEklund
jpg	w15_6umBCBElectrical_atReception.JPG	r1	manage	2338.5 K	2008-11-21 - 12:24	LarsEklund
jpg	w16_12umBCBMechanical_atReception.JPG	r1	manage	2331.5 K	2008-11-21 - 12:24	LarsEklund
jpg	w17_6umBCBMechanical_atReception.JPG	r1	manage	2367.5 K	2008-11-21 - 12:25	LarsEklund
jpg	w18_6umBCBMechanical_atReception.JPG	r1	manage	2350.4 K	2008-11-21 - 12:25	LarsEklund
jpg	w19_6umBCBMechanical_atReception.JPG	r1	manage	2412.7 K	2008-11-21 - 12:25	LarsEklund

This topic: DetDev > WebHome > MCMD
Topic revision: r2 - 2008-11-21 - LarsEklund