Mike Wormald ATLAS Upgrade Bonding programs & referencing documents

http://hep.ph.liv.ac.uk/~mpw/page2.html

MIL-STD-883E, Test Method Standard for Microcircuits

http://scipp.ucsc.edu/groups/fermi/electronics/mil-std-883.pdf

METHOD 2011.7. BOND STRENGTH (DESTRUCTIVE BOND PULL TEST).

http://www.q-tech.com/assets/tests/std883_2011.pdf

METHOD 2023.5. NONDESTRUCTIVE BOND PULL.

http://www.q-tech.com/assets/tests/std883_2023.pdf


This topic: DetDev > WebHome > ATLASStripUpgrade > WireBonding > DocumentsLog
Topic revision: r5 - 2013-03-27 - FredDoherty
 
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