Recent Changes in ATLAS/PUUKA Web retrieved at 17:05 (GMT)
Wafer Probing Info Notes The following modifications should be made to the Probe Card (FE I4A only) Add solder jumper to right side of T1 Add solder jumper...
wafer VPB8WBH Map.pdf: Wafer map VPB8WBH.waprj: waprj file RichardBates 2013 11 27
This wafer is going to LETI for u bump deposition wafermap VMB8WDH.pdf: Wafer Map VMB8WDH.waprj: WAPRJ file RichardBates 2013 02 14
Open Rings Engineering Design page Please add drawings and information as needed to share Comments
Connectivity The UK are developing: Flip chip bump deposition at CEA Leti and flip chip at Advacam Thin chip assemblies with Advacam and CEA Leti...
Flip chip bump deposition at CEA Leti and Flip chip at Advacam The first phase of the development with CEA Leti was the deposition of copper pillars with SAC solder...
Thin chip assemblies To be able to flip chip very thin ROICs addtional work is required to prevent the ROIC from bowing duringthe solder re flow process. At present...
Flip chip bonding at STFC RAL STFC/RAL are developing a fine pitched Indium flip chip process. The samples first have an under bump metal (UBM) layer deposited upon...
The connective task has two main areas of work, TSV and flip chip bonding development. Flip chip bonding at STFC RAL STFC/RAL are developing a fine pitched Indium...
25/07/2012 The Quad assemblies 2 and 3 are made with full thickness ROIC as there is a worry about wafer bow and unbonded edge pixels. Stock Location StatusOfAssemblies...
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