Recent Changes in ATLAS/PUUKA Web retrieved at 09:56 (GMT)

Glue Stencil A set of jigs have been made to hold the pixel assembly, apply glue via a stencil to the back of the assembly and then lower the flex to the assembly...
Rice Paper method The jig set is very similar to that used for the stencil method. The major differences is that a layer of rice paper is loaded with adhesive and...
Useful workpackage links: site meetings Vidyo portal Modules Our FEI4 wafers Wafer Probing Module Assembly Assemblies...
Services Electrical services The elecrical services have been re desgned to take the data off the ring tape and to include DCS. This includes a re design of the...
Older Module flex versions This is the list of the older quad module flexes Flex design files : version Dec 2014 (v1.11) These are the flex hybrids that will be manufactured...
Older Module flex versions This is the list of the older quad module flexes Flex design files : version Dec 2014 (v1.11) These are the flex hybrids that will be manufactured...
SCCB.docx: Document with set up for direct powering FE I4B SingleChipCard AE.pdf: PDF of design PCBBonds PCBDesign.pptx: Bonding diagram with direct powering...
Characterisation of Single Devices in Glasgow University and the UK Assembly Details SCCvFEI4B Some notes on assembly, including wirebond program, are given here...
Irradiations Here are collected details of the irradaitions for sesnors and modules. Facilities B`ham Paul Dervan and Phil Allport are in charge of this activity...
Pixel Weekly vidyo/phone meetings Thursdays at 10:00 am (UK time) portal or Vidyo portal In general, indico pages are listed in: https://indico.cern.ch/categoryDisplay...

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Topic revision: r1 - 2006-11-15 - TWikiContributor
 
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