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5 Quad assemblies will be made. Based on the IV characteristics the summary and selection for flip-chip assembly has been made:

Layout of the Pixel II and quad (Pixel IV) wafers

IVs for the sensors on the Pixel II wafers and Pixel IV (Quad) wafers after UBM and dicing at VTT

-- RichardBates - 2011-05-19

Topic attachments
I Attachment History Action Size Date Who Comment
Microsoft Word filedocx Pixel2QuadSensorWafersOverview.docx r1 manage 142.8 K 2012-04-20 - 10:55 RichardBates Layout of Pixel II and Pixel IV (Quad) wafer
Microsoft Word filedocx Summary_of_sensors_and_their_quality_from_FE.docx r1 manage 67.6 K 2012-06-06 - 14:30 RichardBates Quad sensor IV summary
Microsoft Excel Spreadsheetxlsx VTT-FEI4-SC-QUAD-IV-APRIL2012.xlsx r1 manage 73.5 K 2012-04-20 - 11:06 RichardBates IV from Pixel 11 (2615-19) and Pixel iV (2873-18)
Microsoft Excel Spreadsheetxlsx VTT-FEI4-SC-QUAD-IV-MAY2012.xlsx r2 r1 manage 84.0 K 2012-06-06 - 14:52 RichardBates IV from Pixel II (2873-19) and Pixel IV (2935-21)
Microsoft Word filedocx quad-mask-sensor-details.docx r1 manage 37.0 K 2012-06-06 - 15:41 RichardBates Description of devices on the Pixel IV (Quad) wafer
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Topic revision: r5 - 2012-06-06 - RichardBates
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