Project close-out and kick-off meeting

Wednesday 24th and Thursday 25th April 2013

Glasgow

Link to the agenda page:

https://indico.cern.ch/conferenceDisplay.py?confId=247097

Monday 22nd Feb 2012

Glasgow

Link to the agenda web page is:

https://indico.cern.ch/conferenceDisplay.py?confId=179970

Talks given by:

• Introduction: Craig Buttar
• 3D sensor status: Steve Watts
• Quad module status: Richard Bates
• Mechanics: Jo Pater
• Status of bump bonding: John Lipp
• Quad readout development: Jo Pater and Simon Brown
• Discussion of future project: Craig Buttar

Wednesday 16th March 2011

Manchester

Link to the agenda web page is:

http://agenda.hep.manchester.ac.uk/conferenceDisplay.py?confId=2678

Talks given by:

Craig Buttar: Introduction

Gianluigi Casse: Planar sensors IBL ansd beyond

Richard Bates: Modules

Tim Greenshaw: Layout and Mechanics

John Matheson: MCM_d at RAL

John Lipp: Bump bodning progress at RAL

Jo Pater: Towards a 4-chip module

Tuesday 23rd November 2010

Manchester

Link to the agenda web page is:

https://indico.cern.ch/conferenceDisplay.py?confId=114412

Talks given by:

Craig Buttar: Introduction

Cinzia Da Via: 3D sensors

Gianluigi Casse: Planar Sensors

Richard Bates: Modules

Timothy Greenshaw: Layout and Mechanics

John Lipp: Bump-bonding

Richard Plackett: Bump-bonding

Philip Allport: ATLAS upgrade organisation: IT-SC

Cinzia Da Via: IBL sensor prototyping programme

Philip Clark: Simulation

Wednesday 22 September 2010

Glasgow

Link to the agenda web page is:

https://indico.cern.ch/conferenceDisplay.py?confId=107974

Note that the password is upgrade

This is the kick-off meeting for the UK ATLAS upgrade Pixel project

Talks given by:

Craig Buttar: Introduction

Cinzia Da Via: Status of 3D sensors and plans

Gianluigi Casse: Status of planar sensor development and plans

Anthony Affolder: Report on planar pixels meeting

Timothy Greenshaw: Layout studies and plans

Tim Jones: Report from LBL workshop and plans for mechanics

Mike Tyndel: Report on interconnects

Richard Plackett: Report on LHCb VELO Upgrade and Timepix development

Richard Bates: Plans for single-chip module

-- RichardBates - 2011-01-21