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ThomasMcMullen 2012 07 13
RichardBates 2010 12 16 Sensors Connectivity Modules Connectivity
Thermal FEA Heat load from RD53A chip For the cooling capacity calculations and the FEA simulations the heat load of the RD53A chip is required. Power from the RD53A...
Thin chip assemblies To be able to flip chip very thin ROICs addtional work is required to prevent the ROIC from bowing duringthe solder re flow process. At present...
Number of topics: 5

Topic revision: r32 - 2017-09-22 - RichardBates
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