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Results from ATLAS/PUUKA web retrieved at 11:09 (GMT)

SCCB.docx: Document with set up for direct powering FE I4B SingleChipCard AE.pdf: PDF of design PCBBonds PCBDesign.pptx: Bonding diagram with direct powering...
28/5/2012 Sensors chosen to flip chip in the second run are: From Pixel II (2873 18) SC9 RD50 guard IBL ganged pixels (baseline) SC10 RD50 guard IBL...
CERN Pixel VI Mini Production summary of IVs CP6 summary.pdf: CPVI IV summary mini production Tracking wafer through the process CP6 3164 6 wafer level...
Services Electrical services The elecrical services have been re desgned to take the data off the ring tape and to include DCS. This includes a re design of the...
Characterisation of Single Devices in Glasgow University and the UK Assembly Details SCCvFEI4B Some notes on assembly, including wirebond program, are given here...
JoleenPater 2013 08 13 Stepped Geometry Prototype NB this prototype was shelved in 2013 when the Open Rings layout was adopted. Peter Sutcliffe`s drawings for a...
Number of topics: 6

Topic revision: r32 - 2017-09-22 - RichardBates
 
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