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Results from ATLAS/PUUKA web retrieved at 16:33 (GMT)

IV Characteristics of the FBK 7 assembly: IV Curve FBK 200212.xlsx Details of noise characterisation of the FBK 7 assembly: FBK Noise.pptx Further information on FBK...
FEI 4 Documentation Documentation for FEI can be found at pixel upgrade elec/Final%20Design/Reference/ (NB: Requires cern id and...
24th 25th June 2015 Manchester INDICO: 10 11th December 2013 Manchester INDICO agenda, slides etc :
Meeting in Manchester to scope out Manchester involvement in the UK pixel activity in the pixel hybrid RichardBates 2010 12 17
Flip chip bump deposition at CEA Leti and Flip chip at Advacam The first phase of the development with CEA Leti was the deposition of copper pillars with SAC solder...
Number of topics: 5

Topic revision: r32 - 2017-09-22 - RichardBates
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