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Results from ATLAS/PUUKA web retrieved at 12:42 (GMT)

CO2 blow off systems in WP2 Please use the space below to describe your system and how you use it. It would be helpful if you could include any modifications you have...
CO2 cooling The CO2 cooling of the pixel endcap system is being developed by Manchester in collabraotion with Glasgow, Sheffield and Lancaster. Some useful info on...
The connective task has two main areas of work, TSV and flip chip bonding development. Flip chip bonding at STFC RAL STFC/RAL are developing a fine pitched Indium...
Connectivity The UK are developing: Flip chip bump deposition at CEA Leti and flip chip at Advacam Thin chip assemblies with Advacam and CEA Leti...
Number of topics: 4

Topic revision: r32 - 2017-09-22 - RichardBates
 
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