Difference: WireBonding (3 vs. 4)

Revision 42012-03-06 - AndrewBlue

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META TOPICPARENT name="ATLASStripUpgrade"
-- AndrewBlue - 2012-02-20
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Wire Bondging Trials
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Wire Bonding Trials
 
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 Silicon (with DC) and 200um long AISC pad samples should be:
  • seperated (edge to edge) in xb y 335um
  • seperated (edge to edge) in y by 1742um or sepereated from bond edge to bond edge by ????um
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Hybrid Bonding Diagrams
View topic | History: r8 < r7 < r6 < r5 | More topic actions...
 
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