Difference: DocumentsLog (1 vs. 5)
Revision 52013-03-27 - FredDoherty
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Mike Wormald ATLAS Upgrade Bonding programs & referencing documents http://hep.ph.liv.ac.uk/~mpw/page2.html  | ||||||||
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MIL-STD-883E, Test Method Standard for Microcircuits
http://scipp.ucsc.edu/groups/fermi/electronics/mil-std-883.pdf
METHOD 2011.7. BOND STRENGTH (DESTRUCTIVE BOND PULL TEST).
http://www.q-tech.com/assets/tests/std883_2011.pdf
METHOD 2023.5. NONDESTRUCTIVE BOND PULL.
http://www.q-tech.com/assets/tests/std883_2023.pdf | |||||||
Revision 42013-03-07 - AndrewPickford
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Revision 32013-02-11 - FredDoherty
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Revision 22012-07-02 - FredDoherty
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Revision 12012-06-29 - FredDoherty
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