Difference: Our_FEI4_wafers (8 vs. 9)

Revision 92013-06-13 - RichardBates

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META TOPICPARENT name="Modules"
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At present we have two FE-I4 wafers at VTT. A third is on its way. Two wafers belong to the UK and the third to MPI. The plan is that MPI and the UK share the cost of the FE-I4A UBM and bump masks.
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There are a number of FE-I4 wafers A and B that belong to the UK for the ATLAS module upgarde project.
 

Wafers

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  • FE-I4A wafers
 
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V6ABC1H
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V6ABC1H - Processed at VTTat 200um thickness
  V5ABC2H - returned

VZABC8H

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VBABAXH
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VBABAXH - Processed at VTT full thickness
  V2AQMLH
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  • FE-I4B wafers
 VMB8WDH - for LETI u-bump depositio, technology run 1

V6B8WUH - for LETI u-bump deposition, technology run 1

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  ABPJXGH - For LETI technology run 2 (wafer map available and to be uploaded)
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VWB6IVH - Processing at Advacamat full thickness
 -- AndrewStewart - 2012-07-31 \ No newline at end of file
 
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