Difference: ModuleFlex (17 vs. 18)

Revision 182017-09-19 - SnehaNaik

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META TOPICPARENT	name="Modules"

Module Flex

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https://espace.cern.ch/atlas-project-upgrade-UK/WP1/Forms/AllItems.aspx?RootFolder=%2Fatlas%2Dproject%2Dupgrade%2DUK%2FWP1%2FPix%5FQuad%5FDocs&FolderCTID=0x0120002E98033CFF626142BE1899F87D8B6F28&View={8C524712-F3D0-4480-B753-D977C03D97EA}&InitialTabId=Ribbon%2EDocument&VisibilityContext=WSSTabPersistence

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Test Coupon for PixFlex v3

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This test coupon is designed to test a few functionalities for QA/QC of the PixFlex v3 design.

TestCoupon_QA_QC_Design Data

The folder has the Altium design files and the gerbers for the test coupon.

Comments

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META FILEATTACHMENT	attachment="Flex_Thermal.zip" attr="" comment="Zip of design files" date="1480508288" name="Flex_Thermal.zip" path="Flex_Thermal.zip" size="1798739" user="RichardBates" version="1"
META FILEATTACHMENT	attachment="PixFlex_Adaptor__Gerbers_v2.1_26Jan16.zip" attr="" comment="Quad Flex adapter card" date="1480508649" name="PixFlex_Adaptor__Gerbers_v2.1_26Jan16.zip" path="PixFlex_Adaptor__Gerbers_v2.1_26Jan16.zip" size="69258" user="RichardBates" version="1"
META FILEATTACHMENT	attachment="Assembly_jw06130367_PCB_v2.2.zip" attr="" comment="Gerbers" date="1480509734" name="Assembly_jw06130367_PCB_v2.2.zip" path="Assembly_jw06130367_PCB_v2.2.zip" size="47456" user="RichardBates" version="1"

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META FILEATTACHMENT	attachment="TestCoupon_QA_QC_Design_Data.zip" attr="" comment="QA/QC test coupon for PixFlex v3" date="1505829180" name="TestCoupon_QA_QC_Design_Data.zip" path="TestCoupon_QA_QC_Design_Data.zip" size="627934" user="SnehaNaik" version="1"

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