Difference: Face_to_face_meetings (4 vs. 5)

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Project close-out and kick-off meeting

Wednesday 24th and Thursday 25th April 2013

Glasgow

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19th September 2013

Liverpool

INDICO agenda, slides etc | Vidyo Portal

Wednesday 24th and Thursday 25th April 2013 - Project close-out and kick-off meeting

Glasgow

Link to the agenda page:

https://indico.cern.ch/conferenceDisplay.py?confId=247097

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Monday 22nd Feb 2012

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Monday 22nd Feb 2012

Glasgow

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Quad readout development: Jo Pater and Simon Brown
Discussion of future project: Craig Buttar

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Wednesday 16th March 2011

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Wednesday 16th March 2011

Manchester

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Talks given by:

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Craig Buttar: Introduction

Gianluigi Casse: Planar sensors IBL ansd beyond

Richard Bates: Modules

Tim Greenshaw: Layout and Mechanics

John Matheson: MCM_d at RAL

John Lipp: Bump bodning progress at RAL

Jo Pater: Towards a 4-chip module

Tuesday 23rd November 2010

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Craig Buttar: Introduction
Gianluigi Casse: Planar sensors IBL ansd beyond
Richard Bates: Modules
Tim Greenshaw: Layout and Mechanics
John Matheson: MCM_d at RAL
John Lipp: Bump bonding progress at RAL
Jo Pater: Towards a 4-chip module

Tuesday 23rd November 2010

Manchester

Line: 58 to 57

Talks given by:

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Craig Buttar: Introduction

Cinzia Da Via: 3D sensors

Gianluigi Casse: Planar Sensors

Richard Bates: Modules

Timothy Greenshaw: Layout and Mechanics

John Lipp: Bump-bonding

Richard Plackett: Bump-bonding

Philip Allport: ATLAS upgrade organisation: IT-SC

Cinzia Da Via: IBL sensor prototyping programme

Philip Clark: Simulation

Wednesday 22 September 2010

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Craig Buttar: Introduction
Cinzia Da Via: 3D sensors
Gianluigi Casse: Planar Sensors
Richard Bates: Modules
Timothy Greenshaw: Layout and Mechanics
John Lipp: Bump-bonding
Richard Plackett: Bump-bonding
Philip Allport: ATLAS upgrade organisation: IT-SC
Cinzia Da Via: IBL sensor prototyping programme
Philip Clark: Simulation

Wednesday 22 September 2010

Glasgow

Line: 91 to 81

Talks given by:

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Craig Buttar: Introduction

Cinzia Da Via: Status of 3D sensors and plans

Gianluigi Casse: Status of planar sensor development and plans

Anthony Affolder: Report on planar pixels meeting

Timothy Greenshaw: Layout studies and plans

Tim Jones: Report from LBL workshop and plans for mechanics

Mike Tyndel: Report on interconnects

Richard Plackett: Report on LHCb VELO Upgrade and Timepix development

Richard Bates: Plans for single-chip module

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Craig Buttar: Introduction
Cinzia Da Via: Status of 3D sensors and plans
Gianluigi Casse: Status of planar sensor development and plans
Anthony Affolder: Report on planar pixels meeting
Timothy Greenshaw: Layout studies and plans
Tim Jones: Report from LBL workshop and plans for mechanics
Mike Tyndel: Report on interconnects
Richard Plackett: Report on LHCb VELO Upgrade and Timepix development
Richard Bates: Plans for single-chip module

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