Difference: Connectivity (6 vs. 7)

Revision 72014-10-01 - KateDoonan

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The connective task has two main areas of work, TSV and flip-chip bonding development.
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RCE System

Bump yield studies performed in September 2014 by Kate Sexton
 All modules tuned to and operated at 3000e threshold, 10ToT @ 16ke reference charge.

Module 14-07-24_S2:

Tune to 3000e, 10ToT @ 16ke


Module 14-07-25_S4:

Tune to 3000e, 10ToT @ 16ke


Bump Yield Studies
  Bump Yield assessed by performing Threshold Scans with and without sensor bias and performing source scans with Strontium-90 beta source and Americium-241 60keV gamma ray source.
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META FILEATTACHMENT attachment="21082014_Indium-DanSmaranda.pdf" attr="" comment="Bump Yield Studies by Richard Bates and Dan Smaranda 08/2014" date="1411652282" name="21082014_Indium-DanSmaranda.pdf" path="21082014_Indium-DanSmaranda.pdf" size="613055" user="KateDoonan" version="1"
META FILEATTACHMENT attachment="Indium-Characterisation_0914.pptx" attr="" comment="Bump yield studies by Kate Sexton" date="1411652373" name="Indium-Characterisation_0914.pptx" path="Indium-Characterisation_0914.pptx" size="593882" user="KateDoonan" version="1"
META FILEATTACHMENT attachment="Screen_Shot_2014-09-25_at_14.50.52.png" attr="" comment="IV Characteristics of Modules before and after processing" date="1411653108" name="Screen_Shot_2014-09-25_at_14.50.52.png" path="Screen Shot 2014-09-25 at 14.50.52.png" size="159806" user="KateDoonan" version="1"
META FILEATTACHMENT attachment="14-07-24_S2_3000eTuning.pptx" attr="" comment="" date="1412174595" name="14-07-24_S2_3000eTuning.pptx" path="14-07-24_S2_3000eTuning.pptx" size="163126" user="KateDoonan" version="1"
META FILEATTACHMENT attachment="14-07-25_S4_3000eTuning.pptx" attr="" comment="" date="1412174628" name="14-07-25_S4_3000eTuning.pptx" path="14-07-25_S4_3000eTuning.pptx" size="157841" user="KateDoonan" version="1"
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