Difference: Connectivity (4 vs. 5)

Revision 52014-04-03 - RichardBates

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META TOPICPARENT name="Tasks"
The connective task has two main areas of work, TSV and flip-chip bonding development.
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  Sensor : CPII Live FE-I4 MPI Guard IBL
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Indium_BumpYield_28032014.pptx: Bump Yield Studies March 2013
 

TSV

Details of the TSV activity are given on the next page.

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 -- RichardBates - 2011-06-09

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META FILEATTACHMENT attachment="Indium_BumpYield_28032014.pptx" attr="" comment="Bump Yield Studies March 2013" date="1396510064" name="Indium_BumpYield_28032014.pptx" path="Indium_BumpYield_28032014.pptx" size="651796" user="RichardBates" version="1"
 
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