Difference: Connectivity (4 vs. 5)

Revision 52014-04-03 - RichardBates

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META TOPICPARENT	name="Tasks"

The connective task has two main areas of work, TSV and flip-chip bonding development.

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Sensor : CPII Live FE-I4 MPI Guard IBL

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Indium_BumpYield_28032014.pptx: Bump Yield Studies March 2013

TSV

Details of the TSV activity are given on the next page.

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-- RichardBates - 2011-06-09

META FILEATTACHMENT

attachment="Report_on_SEM_Secondary_electron_images_and_EDX_measurements_on_In_bumps_from_RAL.docx" attr="" comment="Report on SEM for Indium bump from RAL" date="1339684065" name="Report_on_SEM_Secondary_electron_images_and_EDX_measurements_on_In_bumps_from_RAL.docx" path="Report on SEM Secondary electron images and EDX measurements on In bumps from RAL.docx" size="10127772" stream="Report on SEM Secondary electron images and EDX measurements on In bumps from RAL.docx" tmpFilename="/usr/tmp/CGItemp39532" user="RichardBates" version="2"

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META FILEATTACHMENT	attachment="Indium_BumpYield_28032014.pptx" attr="" comment="Bump Yield Studies March 2013" date="1396510064" name="Indium_BumpYield_28032014.pptx" path="Indium_BumpYield_28032014.pptx" size="651796" user="RichardBates" version="1"

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