Difference: Connectivity (3 vs. 4)

Revision 42014-03-31 - RichardBates

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The connective task has two main areas of work, TSV and flip-chip bonding development.
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  The report's conclusion is that the gold does indeed appear to have migrated into the Indium bump.

Frist Indium Flip-chip bonded FE-I4

The first indium assembly wafer ID : VMB6NJH die 3

Sensor : CPII Live FE-I4 MPI Guard IBL



Details of the TSV activity are given on the next page.

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