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ATLAS QMUL visit notic instructions Article text. Hello All, I have been monitoring travel spend via budget information from finance, however this is not reliable...
PpeGroup Member list (comma separated list): Set GROUP AndrewBlue, CatherineWright, KennyWraight, AidanRobson, ChrisCollins, CraigButtar, DavidPennicard...
PuukaGroup Member list (comma separated list): Set GROUP AndrewPickford, RichardBates, JohnLipp, ThomasMcMullen, CraigButtar, TonyAffolder, PhilAllport...
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Travel and Expenses information This page contains information for staff and students on travel expenses as well as accomodation while at CERN. Student information...
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Number of topics: 6

Results from ATLAS/PUUKA web retrieved at 17:26 (GMT)

wafer ABPJXGH Map.pdf: ABPJXGH Wafer Map RichardBates 2013 07 12
25/07/2012 The Quad assemblies 2 and 3 are made with full thickness ROIC as there is a worry about wafer bow and unbonded edge pixels. Stock Location StatusOfAssemblies...
This device was mounted on a single chip card, checked to be fine, and sent to CERN for testbeam in September 2012. RichardBates 2012 10 09
VTT Assembly15 3200e 100V Tuned.cfg.root: Assembly15 Config file 3200electrons ToT8 100V Det Bias VTT Assembly15 1600e 100V Tuned.cfg.root: Assembly15 Config...
Unfortunately this assembly was broken due to an accident with the probe station. The detector of the assembly was being IVed on arrival in Glasgow, before wirebonding...
Assembly 5 Device IV after flip chip and mouting on the SCC. Assembly5 02082012.pptx: Presentation of scans performed on Assembly 5 VTT Assembly5 3200e 100V...
The single chip card usually has a cut out below the FE I4A chip to facilitate Sr 90 source tests. The FE I4A is mounted on a 0.5mm Al plate that is glued to the SSC...
The connective task has two main areas of work, TSV and flip chip bonding development. Flip chip bonding at STFC RAL STFC/RAL are developing a fine pitched Indium...
24th 25th June 2015 Manchester INDICO: https://indico.cern.ch/event/402689/ 10 11th December 2013 Manchester INDICO agenda, slides etc : https://indico.cern.ch/event...
Meeting in Manchester to scope out Manchester involvement in the UK pixel activity in the pixel hybrid RichardBates 2010 12 17
The details of this device can be found at https://twiki.cern.ch/twiki/bin/viewauth/Atlas/PixelUpgrade3DSystematicStudies#FBK Devices This device was then shipped...
IBL Testbeam e group for IBL testbeam: atlas ibl testbeam #64;cern.ch To sign up for the 2011 CERN testbeam go to: http://doodle.com/488d4629pxc9tyed IBL testbeam...
IBL Testbeam e group for IBL testbeam: atlas ibl testbeam #64;cern.ch Testbeam runs 2 Testbeam runs have been performed at DESY using the EUDET telescope. Information...
Silicon sensors with various pixel geometries adapted for a common readout ASIC Link to Publication: http://iopscience.iop.org/1748 0221/9/11/C...
RichardBates 2011 04 16 See attachments for cool box drawing for EUDET telescope as of Sept2012, note this is not compatible with the QUAD module due as it is not...
First meeting 17122010 RichardBates 2010 12 16
This wafer has been on the probe station for longe than usual due to the testing of a new probe card. The dirt is a worry. The wafer will eiterh be replaced by a wafer...
Pixel Weekly vidyo/phone meetings Thursdays at 10:00 am (UK time) portal or Vidyo portal In general, indico pages are listed in: https://indico.cern.ch/categoryDisplay...
SCCB.docx: Document with set up for direct powering FE I4B SingleChipCard AE.pdf: PDF of design PCBBonds PCBDesign.pptx: Bonding diagram with direct powering...
28/5/2012 Sensors chosen to flip chip in the second run are: From Pixel II (2873 18) SC9 RD50 guard IBL ganged pixels (baseline) SC10 RD50 guard IBL...
CERN Pixel VI Mini Production summary of IVs CP6 summary.pdf: CPVI IV summary mini production Tracking wafer through the process CP6 3164 6 wafer level...
Characterisation of Single Devices in Glasgow University and the UK Assembly Details SCCvFEI4B Some notes on assembly, including wirebond program, are given here...
RichardBates 2010 12 16 Sensors Connectivity Modules Connectivity
RichardBates 2011 01 21 Useful Twikis IBL https://twiki.cern.ch/twiki/bin/viewauth/Atlas/IBL USBPIX http://icwiki.physik.uni bonn.de/twiki/bin/view/Systems/UsbPix...
27/7/2012 Some Red chips sent to RAL and MPI Die Status 3 2.xlsx: Die status as of 27/7/2012 14/7/2012 2 Green chips sent to glasgow for wafer probing Die...
This wafer is going to LETI for u bump deposition wafermap V6B8WUH.pdf: Wafer Map V6B8WUH.waprj: Waprj file RichardBates 2013 02 14
Wafer map wafer V7B8WTH Map.pdf: Wafer Map RichardBates 2013 07 03 V7B8WTH.waprj: Waprj file
wafer VEB6NSH Map.pdf: Wafer map RichardBates 2013 11 27
wafer VIB62GH Map.pdf: Wafer Map VIB62GH.waprj: Waprj file RichardBates 2013 11 27
wafer VJB8WGH Map.pdf: Wafer map RichardBates 2013 11 27
Wafer map wafer VKB8WFH Map.pdf: Wafer Map RichardBates 2013 07 03
This wafer is going to LETI for u bump deposition wafermap VMB8WDH.pdf: Wafer Map VMB8WDH.waprj: WAPRJ file RichardBates 2013 02 14
wafer VPB8WBH Map.pdf: Wafer map VPB8WBH.waprj: waprj file RichardBates 2013 11 27
wafer VTB8W7H Map.pdf: Wafer map RichardBates 2013 11 27
This wafer was broken during the wafer thinning process wafer VUAYCRH Map.pdf: Wafer map RichardBates 2013 11 26
wafer VUB6NCH Map.pdf: Wafer Map RichardBates 2013 11 27 VUB6NCH.waprj: Waprj file
wafer VWB6IVH Map.pdf: Wafer Map RichardBates 2013 06 13
wafer VYB8XJH Map.pdf: Wafer map RichardBates 2013 11 27
The wafer map, not white spaces are untested. Wafer VZABC8H Wafermap.bmp: picture of wafer map RichardBates 2012 03 01
This is a green chi. Sent to RAL. Prim List used to tune the chip $ Assembly14 Fast Tuning 3200e.prl.root: Data file from Prim List $ 2012 10 08 Wafer...
PCB and wirebonding details for the various Assemblies are given here. Quad Flex v1.11 FLEX1 2.BPX: Quad Flex v1.11 Wire bonding program for BJ820 Zip file...
Number of topics: 42

Results from DetDev web retrieved at 17:26 (GMT)

RichardBates 26 Jan 2009 CNMUbmIVTests2008
RichardBates 29 Jan 2009 UbmSample1 UbmSample2 UbmSample3 UbmSample4 UbmSampleLong
RichardBates 26 Jan 2009 The Glasgow group has developed a system to fabricate Aluminium tracks on glass substrates to be used a pitch adaptors. The masks are designed...
RichardBates 26 Jan 2009 Pitch Adaptor CNM 3D Detectors MCMD ATLAS07 Series3 Detectors
RichardBates 29 Jan 2009 FaninNo2 FaninNo5 FaninNo8 FaninNo17
Number of topics: 7

 
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