Backlinks to FE-I4 in all Webs (Search ATLAS/PUUKA Web only)

Results from ATLAS/PUUKA web retrieved at 01:49 (GMT)

25/07/2012 The Quad assemblies 2 and 3 are made with full thickness ROIC as there is a worry about wafer bow and unbonded edge pixels. Stock Location StatusOfAssemblies...
The connective task has two main areas of work, TSV and flip chip bonding development. Flip chip bonding at STFC RAL STFC/RAL are developing a fine pitched Indium...
JoleenPater 2012 02 16 SimonBrown 2012 02 23 This page contains information about the Data Multiplexer for the Pixel Modules. The Data Multiplexer is intended...
Flip chip bonding at STFC RAL STFC/RAL are developing a fine pitched Indium flip chip process. The samples first have an under bump metal (UBM) layer deposited upon...
RichardBates 2011 04 16 See attachments for cool box drawing for EUDET telescope as of Sept2012, note this is not compatible with the QUAD module due as it is not...
There are a number of FE I4 wafers A and B that belong to the UK for the ATLAS module upgarde project. Wafers wafer metal.gds.zip: FE I4A Top metal layer GDS...
Pixel Weekly vidyo/phone meetings Thursdays at 10:00 am (UK time) portal or Vidyo portal In general, indico pages are listed in: https://indico.cern.ch/categoryDisplay...
RichardBates 2011 01 21 Useful Twikis IBL https://twiki.cern.ch/twiki/bin/viewauth/Atlas/IBL USBPIX http://icwiki.physik.uni bonn.de/twiki/bin/view/Systems/UsbPix...
Wafer Probing Info Notes The following modifications should be made to the Probe Card (FE I4A only) Add solder jumper to right side of T1 Add solder jumper...
Welcome to the 1 web Available Information This Twiki page is intended for gathering all information on the ATLAS upgrade pixel work. Sharepoints: WP1 (Pixel...
Number of topics: 10

 
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